Apple’s custom AI chips with Broadcom to run through 2031

Apple and Broadcom will develop specialised “custom ASIC silicon products” for multiple generations of Apple hardware stretching through 2031, according to a Broadcom security filing cited by CNBC. These custom-built circuits are coveted in the tech industry for being uniquely optimised to handle heavy artificial intelligence workloads.

The chip development is part of a broader multi-year partnership expansion between the two companies worth more than $30 billion, which will see the production of more than 15 billion chips made in the United States. A major share of the agreement includes a $1.5 billion physical expansion of Broadcom’s manufacturing facility in Fort Collins, Colorado.

Broadcom has long supplied the wireless components that allow iPhones and iPads to connect to cellular networks, Wi-Fi and Bluetooth, and the new deal deepens that relationship around custom American-made silicon.

The $30 billion commitment forms part of Apple’s $600 billion, four-year US investment strategy first announced in 2025, marking the single largest financial pledge made under Apple’s American Manufacturing Program.